ZHANG, Yuanxiang, IIETA-CB, China
-
Vol 63, No 2 (2015) - Articles
Electromigration Failure Prediction and Reliability Evaluation of Solder Bumps for FCBGA package
Abstract PDF
ISSN: 0867-888X (Print)
2450-8071 (Online)
2450-8071 (Online)